Business Introduction
We have a professional PCB design team with per capita design ability of more than many years and rich design experience. Proficient in using a variety of EAD tool software, such as: Allegro, POWER PCB, Protel SE, CR5000, WG, CAM350, etc. Can realize the mutual conversion between the schematic diagrams and PCBs of various design software, have a deep understanding of domestic and foreign PCB design specifications and process specifications, PCB layout and wiring design, power supply design, signal integrity analysis (SI) and EMC design Rich experience. Can complete the design process from the schematic diagram to the welding completion. High efficiency, high quality and high cost performance are the biggest advantages of our team.
★High-quality professional engineers with more than 6 years of industry experience per capita and more than 8 years of senior employees.
★Packaging Engineer, Layout Engineer, SI Engineer, EMC Engineer, DFM Engineer... Professional cornerstone.
★The process is supreme, the scale of the team, the accumulation of technology... the greatest guarantee of quality.
★PCB design, board making, welding, seamless docking...the maximum guarantee of delivery
Maximum design layers: 42 layers Minimum via: 6mil (4mil laser hole)
Maximum IN number: 6+ Maximum number of BGAs: 100+
Minimum BGA pitch: 0.25mm Maximum BGA PIN number: 2500
Minimum line width: 2.4mil Highest speed signal: 12G (differential signal)
Minimum line spacing: 2.4mil Highest order HDI: Any layer interconnection (ELIC)
| Product categories: data communication, optical network, multimedia, computer and Internet, medical, aerospace, industrial control, etc. |
Chip types: INTEL, Marvell, Broadcom, Freescale, TI, Qualcomm/Zhan Xun/MTK platform series, etc. |
Design software: Cadence Allegro/Orcad, Mentor WG/PADS, Altium/Protel, Zuken, etc. |
Need to provide information
1. Schematic diagram: a complete electronic document format that can produce the correct netlist (netlist);
2. Mechanical size: provide the specific position and direction identification of the positioning device, and the identification of the specific height-limiting position area;
3、BMO list: mainly to determine and check the device specified packaging information on the schematic diagram;
4. Wiring guide: description of specific requirements for special signals, and design requirements for impedance, stacking, etc.
Based on the schematic diagram, the design cycle is as follows based on the complete packaging of the device：
| Number of layers | Design Cycle |
2L | 2-3 working days |
4L | 4-5 working days |
6L | 6-7 working days |
8 L | 7-8个 working days |
10L | 10-12working days |
PS：The above delivery period is a regular delivery period, and the accurate design delivery period needs to be comprehensively evaluated according to the number of components of the circuit board, the degree of difficulty, the number of layers and other factors!