1、 The difference between copper substrate and aluminum substrate is as follows:
1. The thermal conductivity of copper substrate is twice that of aluminum substrate. The higher the thermal conductivity, the higher the thermal conductivity and the better the heat dissipation function.
2. The copper substrate can be processed into metallized holes, while the aluminum substrate cannot.
3. The elastic modulus of copper and aluminum differ greatly, so the warpage and shrinkage of copper substrate will be smaller than that of aluminum substrate.
2、 Introduction of copper substrate:
Copper substrate is the most expensive of metal substrates. Its thermal conductivity is many times better than that of aluminum substrate and iron substrate. It is suitable for the heat dissipation and building decoration industries of high-frequency circuits, areas with high and low temperature changes, and precision communication equipment.
3、 Introduction of aluminum substrate:
Aluminum substrate is a kind of metal base copper clad plate with good heat dissipation function. Generally, the single panel is composed of three layers, namely, circuit layer (copper foil), insulation layer and metal base layer. For high-end use, there are also double-sided boards designed with the structure of circuit layer, insulation layer, aluminum base, insulation layer and circuit layer. Few applications are multilayer boards, which can be made of ordinary multilayer boards, insulating layers and aluminum substrates.
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